Composition of the abrasive layer

The abrasive layer of the resinoid bonded Diamond Grinding Tool consists of:

  • Abrasive grain
  • Bond
  • Extender

Compact grouted seal without pores


  • very high removal rate based on low bond hardness
  • Short grinding time
  • Low heat development (cool cut)


Application range

Resinoid bonded Diamond & CBN Grinding Tools are used in tool grinding (dry and wet)

Hart metal (with Diamond) or tool-steel (CBN) requires a wear resistant grain with low heat generation.

Reasonable use from 1,0 mm diameter.
Grain concentration:     C 50 – C 150
Recommanded grain size:     D/B 7 – D/B 252